Sputtering apparatus

摘要

There is disclosed a combination of a target of a material other than metals and one of opposed electrodes of a sputtering apparatus for the deposition of thin films on substrates wherein the target is soldered on the electrodes by a low-melting alloy consisting essentially of a Pb-Sn-Zn alloy and at least one additive selected from the group consisting of Sb, Al, Ti, Si, Cd and Cu. This target installation enables to prevent porous or poor heat-conducting targets from the breakage resulting from the increase of the film-forming rate or physical properties of the target material such as ceramics, glasses, resins and the like.