| 摘要 |
PURPOSE:To prevent the contact short-circuit of junction lines by a method wherein the tips of inner leads are thickly formed than the bay of a frame to maintain the tips of the inner leads higher than the upper surface of the frame arranged an element. CONSTITUTION:This composition making the height (thickness) of the tips at inner leads 17 of a frame 15 does not contact junction lines 17 with a semiconductor element 13, and a bed 12. Therefore, a high-reliability device can be obtained. |
