发明名称 RESIN SEALED SEMICONDUTOR DEVICE BALNKING DEVICE
摘要 PURPOSE:To facilitate blanking of high quality resin sealed device by arranging an extruded body which is free to push itself through a hole of a table, above said table with holes permitting a cull-shaped part, a main runner-shaped part and a gate-runner-shaped part to pass through. CONSTITUTION:Fix pins 22 are inserted in holes 21b of a frame 21a of a resin sealed product 21 which is mounted on a table 20 while containing a resin sealed body 21c in a groove 28. Next, a table 24 is lowered to contain upper part of the resin sealed body 21c in a groove 25 and the product 21 is held by the table 24 together with the table 20 and is fixed. An extruded body 24 is dropped on a cull-shaped part 21d above a through hole 27 of the table 20, thereby blanking the cull-shaped part 21d, a main runner-shaped part 21e and a gate-runner-shaped part 21f, resulting in obtaining a resin sealed semiconductor 23 which is separated from the product 21, on the table 20. In this constitution, as the product 21 is fixed durng blanking, there is no gate residual produced on the semiconductor 23 and no breakage of resin, so that a semiconductor with extremely high quality can be obtained.
申请公布号 JPS5988837(A) 申请公布日期 1984.05.22
申请号 JP19820198607 申请日期 1982.11.12
申请人 TOSHIBA KK 发明人 FUJII YOSHIMICHI
分类号 B26F1/14;B29C37/02;H01L21/56 主分类号 B26F1/14
代理机构 代理人
主权项
地址