发明名称 WAFER ANGLE POLISHER
摘要 PURPOSE:To perform the angle polishing of a silicone chip easily and precisely with no personal difference or irregularity by rotating the holding jig of the silicone chip via the magnetic field generated by a rotary magnetic field unit. CONSTITUTION:The magnetic field generated by a rotary magnetic field unit provided in a main body 10 is rotated in the fixed direction around the polishing surface 11 on the main body 10 by the action of a rotary contact 26 driven by a motor 25. A magnet 13 fitted to a holding jig 8 coupled and held by the main body 10 is absorbed and rotated by this magnetic field, and a silicone chip 7 stuck to the slant surface 9 under this holding jig 8 is pressed to the polishing surface 11 and polished. The lubricating liquid dropped from containers 2, 3 in a cover 1 screwed and fitted to the upper end of the main body 10 to the upper surface of the holding jig 8 and silicone powder are stirred and mixed and fed to the lower surface of the holding jig 8 through the penetrating hole 22 of the holding jig 8, and the silicone chip 7 is polished on the polishing surface 11.
申请公布号 JPS60135176(A) 申请公布日期 1985.07.18
申请号 JP19830250770 申请日期 1983.12.23
申请人 MATSUSHITA DENKO KK 发明人 KENO TAKUJI;HAYASHI YOSHISHIGE
分类号 B24B9/00;B24B9/06;B24B37/00;B24B37/04;B24B37/10;B24B41/06 主分类号 B24B9/00
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