| 摘要 |
PURPOSE:To obtain a high-speed silver plating soln. preventing the substitution deposition of silver and reducing the loss of silver by adding a thiocarboxylic acid or a salt thereof, a silver alkali cyanide and a salt which improves the electric conductivity of a bath and buffers the bath at a prescribed pH. CONSTITUTION:This high-speed silver plating soln. contains 20-100mg/l thiocarboxylic acid or salt thereof, a silver alkali cyanide such as KAg(CN)2 and <=10g/l salt which improves the electric conductivity of the bath and buffers the bath at 7.0-9.0pH. The salt includes K2HPO4. Thiobenzoic acid or 2-ethylhexylthio acid is used as the thiocarboxylic acid. An Se compound may be added to the plating soln. so as to improve the luster of a plated film and to enable the formation of a thin plated film having no pinholes.
|
