| 摘要 |
PURPOSE:To enable the surface of each electronic component to come into a uniform temperature without the heating of electronic components at the time of starting operation by a method wherein the outer wall surface layer of an electronic component is provided with a plurality of liquid passages, and one end of a liquid passage is opened into a liquid reserver; then, a liquid passage is provided with many holes open to the vapor space region. CONSTITUTION:Since one end of the capillary 11 of a fin 12 is inserted into the evaporative liquid 15, the liquid 15 is sucked up into the capillary 11 by capillary action and penetrates into a tunnel 10 of a thin plate 8 which has been joined to the back of a semiconductor chip 2. The heat evolved in the semiconductor chip 2 is transmitted to the thin plate 8 in junction with the back of each chip 2 and allows the evaporation of the liquid 15 in a plurality of tunnels 1. The generated vapor goes out of many fine holes 9 connected to the tunnels 10 into the vapor space region 16, passes through this region 16, and moves to the side of a condensation surface 7. Since this surface 7 is cooled in the periphery by a water- cooled jacket 6, the vapor condenses into liquid and the generated liquid 15 returns to the chip 2 side by flowing over the inner wall 14 of a closed container 4 and repeats the same cycles as before. |
