| 摘要 |
PURPOSE:To improve the workability and productivity of whole alignment by a method wherein two non-parallel orientation-flats are formed at the two places on the circumference of a circular plate type member, and these two orientation- flats are utilized simultaneously for positioning. CONSTITUTION:Orientation flats 2 and 3, a part of the circumference of which is rectilinearly notched, are formed at two places, the two places located on the upper and the lower sides as shown in the diagram, on the periphery of a silicon wafer 1. These orientation flats 2 and 3 have an arbitrary angle theta (thetanot equal to 0), and the length l1 of the orientation flats 2 on the under side is made longer than the length l2 of the orientation flat 3 on the upper side. The information such as the alignment mark position of the wafer, on which an alignment is performed, the angle theta of the orientation flats 2 and 3 and the like are inputted into a controlling part in advance, and stoppers 13 and 14 are provided at the prescribed position based on the above-mentioned information. The wafer 1 is placed between said stoppers 13 and 14, and the wafer is set in such a manner that the orientation flats 2 and 3 come into contact with the stoppers 2 and 3. |
