发明名称 BONDING METHOD OF ELECTRODE TO CERAMIC
摘要 PURPOSE:To prevent foul, discolaration and deterioration of ceramics by mounting ceramics provided with electrodes on the heat resisting wire gauze whose surface is formed by the thermal spraying layer of heat resisting ceramics and by performing heat treatment in the annealing furnace of electrode. CONSTITUTION:The stainless steel wire gauze of 10 mesh is used, on which spinel (HgAl2O4) is sprayed with 0.1mm thick by plasma thermal spraying. For the ceramic plate, a disc of piezoelectric material, the constituent of which is Pb0.96Sr0.04(Mg1/3Nb2/3)0.375Ti0.37Zr0.255O3 is used. The silver paste containing frit is printed in a circular form on the disk by screen printing method. When the several ceramic plates manufactured by such a process are arranged on the above wire gauze and are annealed in the mesh belt type tunnel furnace, reactions between the wire gauze and ceramics do not occur at all and the oxidization of wire gauze is prevented by the ceramic material thermally sprayed, which prolongs the life of the metal.
申请公布号 JPS61113292(A) 申请公布日期 1986.05.31
申请号 JP19840235665 申请日期 1984.11.07
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KUSAKABE KENJI
分类号 H01C17/22;H01C17/28;H01C17/30;H01L41/22;H01L41/39 主分类号 H01C17/22
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