| 摘要 |
PURPOSE:To improve the working efficiency by installing a workpiece holding means which holds a workpiece on a feeding means onto an arm which can be transferred to a polishing apparatus so as to correspond to the workpiece holding hole on a carrier. CONSTITUTION:When a carrier 7 and a wafer 8 are mounted onto a polishing apparatus, a purality of carriers 7 are set onto a stand 11, and a cassette 13 into which the wafers 8 are accommodated is set onto a raising and lowering apparatus 14. Then, a transportion belt 15 is driven to lower the raising and lowering apparatus 14, and then the wafer 8 is transported to contact with a stopper 16, and stops under the wafer holding hole on the carrier 7. Then, an arm 11 is lowered to chuck the carrier 7 and the wafer 8 at the same time by the vacuum chucks 4 and 5. Then, the arm 1 is raised and turned, and then stops at the upper-part position for mounting the carrier 7 and the wafer 8 onto the polishing apparatus, and then loading is performed by cutting-off a vacuum source. Afterwards, the processing is repeated by the times equal to the number of pieces of the carriers 7 to be mounted. |
