| 摘要 |
PURPOSE:To reduce the inductance of leadframe for abating the noise by a method wherein a slit part is provided at the wirebonding side and part of inner lead bonded to multiple bonding wires. CONSTITUTION:A rectangular slit part 10 is provided from the end side of inner lead 9 to the VSS pin 8 side. A pair of slitted lead parts 16, 17 and VSS pads 11, 12 are respectively bonded to each other by bonding wires 18, 19. Then the current flowing in the inner lead 9 is branched out into the current i1 and i2 in the same direction so that resultant magnetic field may be offset by the slit part 10. Through these procedures, the inductance of leadframe is reduced abating the noise.
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