| 摘要 |
PURPOSE:To reduce the unnecessary exposed part of an electrode junction surface as much as possible, make the circuit design of a device easy, and improve the performance of the device, by constituting the electrode junction surface in a polygonal form. CONSTITUTION:As for an electrode structure formed on a semiconductor chip 11 wherein the compression bonding metal ball 16 of a metal thin wire 15 for external terminal connection is subjected to compression bonding, the junction surface 12a of an electrode 12 is constituted in a polygonal form. For example, the aluminum electrode 12 is subjected to a patterning in the form of a planar polygon. All corner parts of the electrode except a corner part connected to an aluminum wiring 13 are uniformly indented on the right and the left side, and incision edges 12b are formed whose both sides are made at an angle of 135 deg. respectively. An aperture edges 14a corresponding with the incision edges 12b of the electrode corner parts are arranged on the insulating protective film 14 which covers the surface of the semiconductor substrate 11 so as to contain the peripheral surface of the aluminum electrode 12 and the whole surface of the aluminum wiring 13, and the junction surface 12a exposed in the polygonal form on the electrode surface is constituted. |
