发明名称 |
Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs |
摘要 |
A semiconductor casing is formed of a ceramic-glass-metal composite material with a leadframe embedded in a base component. The leadframe may include holes therethrough to mechanically interlock with the composite material. Also, a process comprises forming a four-sided semiconductor casing having a leadframe with an aluminum cladding that is etched away at the ends extending from the casing.
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申请公布号 |
US4761518(A) |
申请公布日期 |
1988.08.02 |
申请号 |
US19870004469 |
申请日期 |
1987.01.20 |
申请人 |
OLIN CORPORATION |
发明人 |
BUTT, SHELDON H.;CANN, WILLIAM F. |
分类号 |
H01L23/08;H01L23/10;(IPC1-7):H01L23/08 |
主分类号 |
H01L23/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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