| 摘要 |
A cooling structure for cooling integrated circuits. The cooling structure includes integrated circuit cases inside which one of more integrated circuits are mounted. Cold plates are also included which are superimposed on heat radiation surfaces of the integrated circuit cases, respectively, the cold plates each having one end of which is bent. Pressing members are also included which are superimposed on the cold plates, respectively, the pressing members each having one end of which is bent to oppose the bent one end of a respective one of the cold plates. The cooling structure also includes fixing means which fixes each of the cold plates and a corresponding one of the pressing members to corresponding one or more of the integrated circuit cases in a freely detachable manner. The cooling structure also includes cooling pipes with each of the cooling pipes being held in at least one space formed between one end of at least one of the cold plates and one end of a corresponding one of the pressing members.
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