| 摘要 |
The method consists in connecting the component (CI) to a frame (C) placed around its outside, with the aid of conductive wires (F); the component is tested by connecting test equipment to this frame (C). When the tests are performed, the component is fixed onto the substrate on which it is to be mounted, and the connecting of the component to the substrate is effected with wires (F) connecting the component to this frame. After connection, the wires are cut (D) between the pins of the substrate and the frame (C), and the frame is removed. …<IMAGE>… |
