发明名称 LEAD WIRE CONNECTING DEVICE FOR SUPERCONDUCTING EQUIPMENT
摘要 PURPOSE:To make a device small-sized and reduce the cost by controlling the pressure in bellows from the outside to expand and shrink the bellows and selectively connecting movable multi-pin connectors to fixed multi-pin connectors. CONSTITUTION:The pressure in bellows 42 and 43 is controlled to expand or shrink the bellows 42 and 43, thereby movable multi-pin connectors 36 and 37 are selectively connected to fixed multi-pin connectors 31 and 32. In this case, all lead wires 44, 45 and 47-52 are located in the recovery passage of the He gas, thus the lead wires are cooled by the low-temperature He gas. When the connectors 31, 32, 36 and 37 are in a connection state, the heat quantity infiltrating through the lead wires can be suppressed to a small value. Since a refrigerant guide pipe 24 is cooled, the heat infiltration through the guide pipe 24 can be suppressed to a slight value. The connector mechanical can be integrated even if there are many lead wires according to this constitution, thus the device can be made compact, and the cost can be reduced.
申请公布号 JPS6489167(A) 申请公布日期 1989.04.03
申请号 JP19870246158 申请日期 1987.09.30
申请人 TOSHIBA CORP 发明人 WADA TSUKASA;SATO AKIO;YASUDA SATOSHI
分类号 H01R24/00;H01R13/62 主分类号 H01R24/00
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