发明名称 |
Solderless printed wiring board module and multi-module assembly |
摘要 |
A solderless printed wiring board module for receiving and securing surface mounted solderless electronic component carrier and electronic components without carrier upon a printed wiring board, the module also providing a heat transfer path to a surface away from the printed wiring board and the module further adaptable to electrical and mechanical attachment to similar modules placed adjacent to said module to form a multi-module assembly.
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申请公布号 |
US4933808(A) |
申请公布日期 |
1990.06.12 |
申请号 |
US19890350862 |
申请日期 |
1989.05.11 |
申请人 |
WESTINGHOUSE ELECTRIC CORP. |
发明人 |
HORTON, ROALD N.;HARRIS, DAVID B.;BOURDELAISE, ROBERT A. |
分类号 |
H01L23/538;H05K1/18;H05K3/32;H05K7/20 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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