| 摘要 |
PURPOSE:To enable the semiconductor device in tape carrier system as well as high reliability and yield to be manufactured at low cost by heating and pressurizing a tape carrier using a bonding tool abutting thereagainst from an insulating film side. CONSTITUTION:An insulating film 1 and conductor foils 2 are bonded to one another using a bonding agent 3 so as to prepare a tape carrier 14 formed of a circuit pattern of conductors 2 by processing the conductor foils 2 using photoetching process etc. This tape carrier 16 with conductors 2 turning downward is mounted on a semiconductor chip 5 with bumps 6 formed turning upward to make alignment of the bumps 6 with the junction parts of the conductors 2. Successively, a bonding tool 7 is applied from the insulating film 1 side to heat while pressing down for bonding the conductors 2 onto the bumps 6. Through these procedures, the semiconductor devices in high reliability and yield can be manufactured at low cost. |
