| 摘要 |
At least one pair of areas on a circuit pack or substrate is allocated for the placement of electromagnetic interference (EMI) absorbing material, e.g., split ferrite cores. All or a portion of the conductor paths for the circuit are routed between pairs of the allocated areas. After the circuit pack is developed and tested, if EMI suppression is required, the EMI-absorbing material extends around the conductors passing between the pairs of allocated areas using holes formed through the allocated pairs of areas. Such holes are formed prior to circuit assembly or, alternatively, are formed only as needed after circuit testing. A clip is used to secure the EMI-absorbing material to the circuit pack. Advantageously, the insertion and securement of the EMI-absorbing material does not require any soldering or special manufacturing tools or fixtures. Accordingly, it can be readily provided in any manufacturing process.
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