| 摘要 |
<p>PURPOSE:To obtain a film material which can be efficiently manufactured in mass production and has high flexibility by exposing to form a noncopper metal layer on inner leads in which its pattern is altered according to the disposition of an electrode of a semiconductor chip without forming a pattern. CONSTITUTION:A chip placing lead pattern 20 is formed in the center on the surface of a film tape 10a, and the pattern 20 is formed of an outer lead part 21 and an inner lead forming part 23. Since the part 23 is required to be altered in its pattern each time the disposition of an electrode of the chip is altered, the pattern is not formed, and a pattern is previously formed on the part 21. A soldering copper layer m1 is exposed to be formed on the part 21, and a noncopper metal layer m2 having lower reflectivity for a laser light than that of copper is exposed to be formed on the part 23. Thus, it can be efficiently manufactured in mass production to obtain a film having high flexibility.</p> |
