发明名称 MOLDING DIE
摘要 PURPOSE:To obtain a mold product having excellent stable quality by setting each gate at closed positions until a pressure sensor detects the specified increase of pressure and making a sealing resin reach to the terminal section of a runner. CONSTITUTION:When a top force 8 and a bottom force 9 are aligned and fixed tightly, stoppers 11 are inserted, each gate 2 is set at closed positions and a sealing resin is heated and softened, the sealing resin is extruded from a cull 6 to each runner 3 by pressurizing action. Since each gate 2 is set at the closed positions, the sealing resin is moved forward up to the terminals of each runner 3 successively and each cavity 1 is filled completely. When pressure in the runners 3 suddenly increases at that time, a pressure sensor 15 detects the increase of pressure and pressure in the runners reaches specified injection pressure close to injection pressure, an actuator 14 is operated by a controller, the stoppers 11 are pushed down and each gate 2 is opened simultaneously. Accordingly, the sealing resin starts inflow into each cavity 1 at a time, and the sealing resin flows in at the same pressure and the same speed and in the same viscosity.
申请公布号 JPH04201220(A) 申请公布日期 1992.07.22
申请号 JP19900336127 申请日期 1990.11.29
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKAGI HIDEKAZU
分类号 B29C45/26;B29C45/02;B29C45/14;B29C45/27;B29C45/28;B29C45/32;B29C45/77;B29L31/34;H01L21/56 主分类号 B29C45/26
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