| 摘要 |
PURPOSE:To lessen faulty voids which are induced at resin sealing by difference in resin flow speed between the upper side and the lower side of a package. CONSTITUTION:Concerning the lead frame of a resin-sealed semiconductor device, a part of a semiconductor mounting pad 1a located opposite to a resin inlet 10 is formed into a structure 2a or a protuberant part that is pushed up to be level with a semiconductor element 7, and a film 8 of resin such as polyimide or the like where a wiring pattern 9 is formed through electroless plating or the like is bonded to the structure 2a or the protuberance part. Furthermore, a semiconductor element can be electrically connected to inner leads through the intermediary of the wiring pattern concerned with bonding wires 5 of gold or the like. |
