| 摘要 |
Method for manufacturing an electronic module, which electronic module includes a component ( 6 ), which is connected electrically to a conductor-pattern layer ( 14 ). In the method contact openings ( 17 ) are made in the conductor layer ( 4 ), the mutual positions of which correspond to the mutual positions of the contact areas ( 7 ) of the component ( 6 ). After this, the component ( 6 ) and the conductor layer ( 4 ) are aligned relative to each other, in such a way that the contact areas ( 7 ) of the component ( 6 ) come to the positions of the contact openings ( 17 ), and the component ( 6 ) is secured. After this, at least in the contact openings ( 17 ) and the contact areas ( 7 ) of the component ( 6 ) a conductor material is made that connects the component ( 6 ) to the conductor layer ( 4 ). After the making of the contact the conductor layer ( 4 ) is patterned to form a conductor-pattern layer ( 14 ).
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