发明名称 WIRING SUBSTRATE AND ITS MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring substrate wherein a metal layer having a nano- and micro-pattern is accurately and locally formed, and its manufacturing method. <P>SOLUTION: The method of manufacturing a wiring substrate 100 includes a step to form a sacrifice layer of a first pattern on the substrate 10; a step to form a catalyst layer of a second pattern on the substrate; a step to deposit a metal layer on the catalyst layer of the second pattern by immersing the substrate in a nonelectrolytic plating liquid; and a step to remove the sacrifice layer by heating and to form a metal layer 34 of a third pattern. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2008258260(A) 申请公布日期 2008.10.23
申请号 JP20070096398 申请日期 2007.04.02
申请人 SEIKO EPSON CORP 发明人 KANEDA TOSHIHIKO;KIMURA SATOSHI;FURUHATA HIDEMICHI;AMAKO ATSUSHI;SAWAKI DAISUKE;KIJIMA TAKESHI
分类号 H05K3/18;H05K3/10 主分类号 H05K3/18
代理机构 代理人
主权项
地址