| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a printed wiring board which can produce a reliable conductor profile or a conductor surface. SOLUTION: The process for producing a printed wiring board comprises a step for forming a photosensitive resin film (3) on a conductive metal layer (2) formed on at least one surface of an insulating base (1); a step for forming a required resist pattern (4), by exposing and developing the photosensitive resin film (3); a first-stage etching step for forming a conductor pattern (5), by removing the exposed conductive metal layer (2) with etching liquid; a step for stripping the photosensitive resin film (3) of the resist pattern (4); and a second-stage etching step for re-processing the conductor pattern (5) thus formed with the etching liquid. COPYRIGHT: (C)2009,JPO&INPIT
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