发明名称 HONEYCOMB STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide a honeycomb structure having excellent thermal shock resistance. <P>SOLUTION: The honeycomb structure 1 comprises: a honeycomb base material 2 composed of a porous ceramics and having a plurality of cells extending to the axial direction; and an outer circumferential material layer 4 composed of a ceramics covering the outer circumferential face in the circumferential direction of the honeycomb base material 2. Provided that the thermal expansion coefficient at 300 to 900&deg;C in the honeycomb base material 2 is denoted as &alpha;<SB>I</SB>(ppm/K) and the thermal expansion coefficient at 300 to 900&deg;C in the outer circumferential material layer 4 is denoted as &alpha;<SB>II</SB>(ppm/K), the value of &alpha;<SB>I</SB>-&alpha;<SB>II</SB>is 1.0 to 5.0(ppm/K). <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008254947(A) 申请公布日期 2008.10.23
申请号 JP20070096661 申请日期 2007.04.02
申请人 TOKYO YOGYO CO LTD 发明人 TSUNEYOSHI KOJI
分类号 C04B41/85;B01D39/20;B01D46/00;B01D53/86;B01D53/94;B01J35/04;C04B35/565;F01N3/02 主分类号 C04B41/85
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