| 摘要 |
A multilayer wiring board includes a substrate and even numbered wiring patterns. The substrate is made of an insulating material. Each of the even numbered wiring patterns is made of a conductive material, and the wiring patterns are laminated onto one another in a lamination direction via the substrate. One of the wiring patterns has a generally equivalent volume to that of a corresponding one of the wiring patterns. Here, the one of the wiring patterns is located on one plane symmetrical to a corresponding plane, on which the corresponding one of the wiring patterns is located, relative to a central position of the wiring patterns in the lamination direction.
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