发明名称 |
ENCLOSURE FOR MOBILE ELECTRONIC DEVICES, AND ITS MANUFACTURING PROCESS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing process of an enclosure for a mobile electronic device in which a manufacturing process is simple, and which can bring about a 3D image on the surface of a cover. <P>SOLUTION: The enclosure for the mobile electronic device contains a substrate including a surface, an ink layer formed on the surface of the substrate, a top coating layer formed on the surface of the substrate and the ink layer. This manufacturing process contains the step of preparing the substrate, the step of carrying out three-dimensional printing to form an ink layer on the surface of the substrate, and the step of carrying out a coating step to form an upper coating layer on the surface of the substrate and the ink layer. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2008254428(A) |
申请公布日期 |
2008.10.23 |
申请号 |
JP20080051161 |
申请日期 |
2008.02.29 |
申请人 |
SUTECH TRADING LTD;SHENZHEN FUTAIHONG PRECISION INDUSTRIAL CO LTD |
发明人 |
KYO TETSUGEN;HANSEN KEN-HOLM |
分类号 |
B41M3/06;B05D1/36;B05D7/00;B41M1/12;B41M1/30;H04M1/23;H05K5/03 |
主分类号 |
B41M3/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|