发明名称 ENCLOSURE FOR MOBILE ELECTRONIC DEVICES, AND ITS MANUFACTURING PROCESS
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing process of an enclosure for a mobile electronic device in which a manufacturing process is simple, and which can bring about a 3D image on the surface of a cover. <P>SOLUTION: The enclosure for the mobile electronic device contains a substrate including a surface, an ink layer formed on the surface of the substrate, a top coating layer formed on the surface of the substrate and the ink layer. This manufacturing process contains the step of preparing the substrate, the step of carrying out three-dimensional printing to form an ink layer on the surface of the substrate, and the step of carrying out a coating step to form an upper coating layer on the surface of the substrate and the ink layer. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008254428(A) 申请公布日期 2008.10.23
申请号 JP20080051161 申请日期 2008.02.29
申请人 SUTECH TRADING LTD;SHENZHEN FUTAIHONG PRECISION INDUSTRIAL CO LTD 发明人 KYO TETSUGEN;HANSEN KEN-HOLM
分类号 B41M3/06;B05D1/36;B05D7/00;B41M1/12;B41M1/30;H04M1/23;H05K5/03 主分类号 B41M3/06
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