| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To restrain a lead sag generated in a process separating a plurality of collectively resin-sealed semiconductor devices, to prevent short-circuit while suppressing an increase in an electric resistance and to provide visually observed control for the lead sag. <P>SOLUTION: A plurality of wirings 3 (lead sections) for device regions 4 are formed so that their widths are narrowed gradually with approaches to a region 5 to be cut from the adjacent section of the region 5 to be cut mutually connecting the device regions 4. That is, the presence of generation of sags and the quantity of sags can be determined by comparing the sectional shapes computed from the sizes of the external-shapes of the extended sections of the wirings 3 and the shapes of the cut surfaces (that is, cut surfaces of the narrow width sections 3a) of wirings after dicing. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
