| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyesterimide, which has a high flame resistance, a low linear thermal expansion coefficient, a low hygroscopic expansion coefficient, a high bond strength to metal, in particular copper, a high glass transition temperature and a flexibility; and to provide a precursor thereof. SOLUTION: The polyesterimide having an ester structure with a repeating unit represented by general formula (9) and a specific aromatic backbone can be preferably utilized for a base material for a flexible printed circuit board (FPC), a base material for tape automated bonding (TAB), an electric insulating film and a substrate for a liquid crystal display in various electron devices, a substrate for an organic electroluminescence (EL) display, a substrate for electronic paper, and a substrate for a solar cell, in particular an FPC substrate material. COPYRIGHT: (C)2009,JPO&INPIT
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