| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable wiring board with the exfoliation of an electrode pad and an insulating layer suppressed. <P>SOLUTION: The method for manufacturing the wiring board comprises a first step of forming the electrode pad comprising a metal on a supporting plate, a second step of etching the supporting plate so that the shape of the supporting plate has a protruding part contacting with the electrode pad, a third step of forming an insulating layer for covering the electrode pad on the surface of the supporting plate, a fourth step of forming a conductive pattern connected to the electrode pad on the surface of the insulating layer, and a fifth step of removing the supporting plate. <P>COPYRIGHT: (C)2009,JPO&INPIT |
