| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method by which solder can be soaked on the end face of a lead when the semiconductor device is mounted to a mounting board. <P>SOLUTION: In the semiconductor device 1, a lead 4 (body part 9) of which the end face 9B is exposed from the side face 5B of seal resin 5. A metal plating layer 14 is formed on the end face 9B. The metal plating layer 14 is composed of a pure metal such as tin (Sn) and indium (In) and having a melting point of 260°C and lower. Thereby, solder can be soaked on the end face 9B of the lead 4 (body part 9) when the semiconductor device 1 is mounted. Consequently, the mounting strength of the semiconductor device 1 on the mounting board can be improved and the reliability of mounting can be improved. Further, a solder fillet can be formed on the end face 9B of the lead 4 (body part 9), so that the appearance of a joined (soldered) state between the lead 4 and the mounting board can be easily inspected. <P>COPYRIGHT: (C)2009,JPO&INPIT |
