| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding machine which grinds the rear surface of a wafer, capable of easily adjusting the tilt of a rotating axis of a holding means, for improved production efficiency and quality of the wafer. SOLUTION: A chuck table 20 is provided with a tilt adjusting means 100 for tilting a rotating axis 20a. The tilt adjusting means 100 is controlled by a grinding condition storing means 120 which stores various wafer grinding conditions and angle adjusting values of the rotating axis 20a which is appropriate to the grinding conditions. By selecting a grinding condition of the wafer 1 from the grinding condition storing means 120, a command is transmitted to the tilt adjusting means 100 from the grinding condition storing means 120. By this, a motor 101 operates, and a bolt member 102, an adjusting pry 103, and an adjusting block 105 operate in interlocked manner, so that a flange 23 tilts with a support part 23a as a supporting point. As a result, the rotating axis 20a of the chuck table 20 tilts according to the grinding condition of the wafer 1. COPYRIGHT: (C)2009,JPO&INPIT
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