| 摘要 |
PROBLEM TO BE SOLVED: To provide a dip molding composition giving a dip molded article having low surface resistivity and keeping sufficiently low surface resistivity even by washing the surface of the article with pure water or ultra-pure water. SOLUTION: The dip molding composition contains a rubber latex and a filler containing an organic polymerized inorganic laminar compound holding a polymer of a polymerizable monomer containing an ammonium ion and intercalated between the layers of the inorganic laminar compound, wherein the content of the organic polymerized inorganic laminar compound is 0.3-5 pts.wt. based on 100 pts.wt. of the solid content of the rubber latex. COPYRIGHT: (C)2009,JPO&INPIT
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