发明名称 |
A METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES AND PACKAGES MADE |
摘要 |
<p>The flexible package ( 100 ) has between a first ( 1 ) and a second side ( 2 ) a semiconductor device ( 20 ) with a thinned back substrate ( 10 ) and an interconnect structure. Contact means ( 31,33 ) for external contact and a first resin layer ( 52 ) are present at the first side ( 2 ) of the package ( 100 ), which contact means ( 31,33 ) are coupled to the interconnect structure. At the second side ( 2 ) the semiconductor device ( 20 ) is at least substantially covered with a second resin layer ( 12 ). The contact means ( 31,33 ) are present on the first resin layer ( 52 ) and are coupled to the interconnect structure with redistribution tracks ( 32,34 ) extending through the first resin layer ( 52 ). A passivation layer ( 55 ) covers the first resin layer ( 52 ) and the redistribution tracks ( 32,34 ) at least substantially.</p> |
申请公布号 |
EP1856728(B1) |
申请公布日期 |
2008.10.22 |
申请号 |
EP20060710970 |
申请日期 |
2006.02.27 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
VAN VEEN, NICOLAAS, J., A.;DEKKER, RONALD;TAK, COEN, C. |
分类号 |
H01L21/60;H01L23/498;H01L23/538 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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