发明名称 |
Optical semiconductor device and method for manufacturing the same |
摘要 |
An optical semiconductor device having a first lead (3) for an optical semiconductor chip (2) to be mounted on and a second lead (4a) for a wire (5) being extended from the optical semiconductor chip (2) mounted on the first lead (3) to be joined to, the device being capable of reducing the possibility of a break of the wire (5) even under a thermal shock and the like. The optical semiconductor device can include: a first lead (3) for an optical semiconductor chip (2) to be mounted on; a second lead (4a) for a wire (5) (for example, gold wire) being extended from the optical semiconductor chip (2) mounted on the first lead (3) to be joined to; a holder part (6) for supporting the first lead (3) and the second lead (4a) at two locations each; a lens part (7); and a light-transmitting sealing part (8). The second lead (4) is separated into two lead pieces (4a, 4b) with a predetermined gap (‰ 0) therebetween as seen in a plan view, within the inside space of the holder part (6) by which the second lead (4a) is supported at two locations. |
申请公布号 |
EP1983580(A2) |
申请公布日期 |
2008.10.22 |
申请号 |
EP20080007660 |
申请日期 |
2008.04.18 |
申请人 |
STANLEY ELECTRIC CO., LTD. |
发明人 |
ISHI, KAZUHISA;FUJII, TAKAAKI;OKUMA, HIROAKI;HIRAMOTO, AKI |
分类号 |
H01L33/62;H01L31/02;H01L31/0203;H01L31/18;H01L33/56 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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