发明名称 |
PROCESS FOR SURFACE TREATING PRINTED CIRCUIT BOARD |
摘要 |
A method for surface treatment of a PCB(Printed Circuit Board) is provided to form a fine circuit under eco-friendly conditions by performing pre-etching and alkali metal solution treatment before and after a desmear process. A method for surface treatment of a PCB includes the steps of: preparing the PCB having an insulating layer with a via hole on one or both surfaces; pre-etching a surface of the insulating layer of the PCB by using a permanganic acid solution(S101); desmearing by using the permanganic acid solution after swelling smear remaining on the surface of the insulating layer of the pre-etched PCB(S102,S103); and treating the surface of the insulating layer of the desmeared PCB with an alkali metal solution of 0.1 to 5N(S104).
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申请公布号 |
KR20080093739(A) |
申请公布日期 |
2008.10.22 |
申请号 |
KR20070037891 |
申请日期 |
2007.04.18 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE, JUNG HAN;NOH, JUNG HYUN;YABUUCHI TSUNEO |
分类号 |
H05K3/06 |
主分类号 |
H05K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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