发明名称 PROCESS FOR SURFACE TREATING PRINTED CIRCUIT BOARD
摘要 A method for surface treatment of a PCB(Printed Circuit Board) is provided to form a fine circuit under eco-friendly conditions by performing pre-etching and alkali metal solution treatment before and after a desmear process. A method for surface treatment of a PCB includes the steps of: preparing the PCB having an insulating layer with a via hole on one or both surfaces; pre-etching a surface of the insulating layer of the PCB by using a permanganic acid solution(S101); desmearing by using the permanganic acid solution after swelling smear remaining on the surface of the insulating layer of the pre-etched PCB(S102,S103); and treating the surface of the insulating layer of the desmeared PCB with an alkali metal solution of 0.1 to 5N(S104).
申请公布号 KR20080093739(A) 申请公布日期 2008.10.22
申请号 KR20070037891 申请日期 2007.04.18
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, JUNG HAN;NOH, JUNG HYUN;YABUUCHI TSUNEO
分类号 H05K3/06 主分类号 H05K3/06
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