| 摘要 |
A method for manufacturing a substrate and a surface treating agent for copper used in the same are provided to form a uniform organic film on the surface of the copper at high density by promoting a coordinate bond of the copper and an organic material through alkylamine derivatives. A method for manufacturing a substrate includes the steps of: contacting a treating solution containing aminotetrazole compounds, aminotriazole compounds, and alkylamine derivatives to at least one of the surfaces of copper and a copper alloy; and forming a resist layer on the surface of the copper or the copper alloy in contact with the treating agent. The treating agent contains aminotetrazole compounds of more than 0.05 wt%, aminotriazole compounds of more than 0.1wt%, alkylamine derivatives of 0.1wt% to 10wt%, and water.
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