摘要 |
A camera module package is provided to minimize thickness of the package by attaching lens at a base, and minimize an error of focus distance between the lens and an image sensor by forming support members between the lens and the base, thereby obtaining reliability of the product. A camera module package(100) comprises a base(120), a light permeating protective cap(140), and support members(130). The base has one surface with an image sensor(122), and pads(126) which are electrically connected with the image sensor. The protective cap is bonded on the base by an adhesive(142) to seal the image sensor. The support member supports at least one lens(110) on the base. A microlens(124) is on the image sensor. The support members are in the pad sequentially. |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
YUAN JING LI;DOH, JAE CHEON;KIM, DAE JUN;LIM, CHANG HYUN;JEUNG, WON KYU |