发明名称 Wet processing device and wet processing method
摘要 The flow of a processing liquid poured onto the surface of a substrate at a standstill to process the substrate from the surface to the back surface of the substrate is suppressed to achieve satisfactory cleaning. When a processing liquid is poured onto a substrate held in a horizontal position by a substrate holding unit to carryout a predetermined process, for example, a cleaning liquid is discharged through a discharge opening corresponding to the entire circumference of the back surface of the substrate before pouring the processing liquid onto the surface of the substrate, and the cleaning liquid discharged on the back surface of the substrate and a liquid flowing from the surface to the back surface of the substrate are sucked through a suction opening corresponding to the entire circumference of the back surface of the substrate and included in a first suction means. Thus an outward flow of the cleaning liquid is produced on the back surface of the substrate. For example, the flow of the liquid from the surface to the back surface of the substrate can be suppressed without resorting to a shake-off action resulting from rotation and, consequently, the substrate can be satisfactorily cleaned.
申请公布号 US7431038(B2) 申请公布日期 2008.10.07
申请号 US20050579979 申请日期 2005.03.31
申请人 TOKYO ELECTRON LIMITED 发明人 NISHIKIDO SHUUICHI
分类号 B08B3/02;B08B5/04;B08B7/04;H01L21/00;H01L21/027;H01L21/304 主分类号 B08B3/02
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