| 发明名称 |
Integrated micro-channels for 3D through silicon architectures |
| 摘要 |
Some embodiments of the present invention include apparatuses and methods relating to integrated micro-channels for removing heat from 3D through silicon architectures. |
| 申请公布号 |
US7432592(B2) |
申请公布日期 |
2008.10.07 |
| 申请号 |
US20050250644 |
申请日期 |
2005.10.13 |
| 申请人 |
INTEL CORPORATION |
发明人 |
SHI WEI;LU DAOQIANG;BAI YIQUN;ZHOU QING A.;HE JIANGQI |
| 分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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