| 摘要 |
For a plurality of divided areas on a wafer that is exposed by generating measurement pattern images, a predetermined statistic that includes the deviation of the luminance value of each pixel included in imaging data obtained by the imaging with respect to a predetermined reference value is computed, for example, the variance is computed, and optical characteristics of a projection optical system are obtained based on a computation result of the computed statistic of each of the divided areas (steps 504, 506, 512 and 514 ). Therefore, the optical characteristics can be measured with good repeatability even by a measurement device such as a microscope having a lower resolution compared with the SEM or the like, for example, an alignment sensor by an image-forming method of an exposure apparatus or the like.
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