| 摘要 |
A COF package in exemplary form includes a flexible base film, inner leads each made of metal and having a thickness d 1 , which are disposed at a peripheral edge of a semiconductor chip-mounted predetermined spot on the base film and protruded into the semiconductor chip-mounted predetermined spot, dummy patterns having a thickness d 2 (<(d 1 +d 3 ), where d 3 is the thickness of the electrodes), which are disposed at predetermined positions within the semiconductor chip-mounted predetermined spot, a semiconductor chip, and an encapsulating resin. The semiconductor chip has a plurality of the electrodes each protruded into a main surface thereof and having the thickness d 3 . The electrodes are bonded to the inner leads respectively. Further, the encapsulating resin is charged between the base film and the semiconductor chip. The shape and/or position of the dummy patterns may mark the function of one or more inner leads.
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