| 摘要 |
<p>A device for pressing an electronic component in which the pressing loads on the die and the substrate of the electronic component can be managed individually, the pressing load on the die of the electronic component can be managed delicately as required, and adhesion of a pressing member to the die of the electronic component can be enhanced. The device for pressing an electronic component that presses the terminal of an electronic component under test against the contact portion of a test head comprises a first pressing member (51) for pressing the die (81) of an IC device (8), a second pressing member (52) for pressing the substrate (82) of the IC device (8), and a gimbal mechanism (54) for making the first pressing member (51) adhere to that die (81) when the first pressing member (51) presses the substrate (82) of the IC device (8). Four pneumatic pressure cylinders (56) impart pressing loads to the gimbal mechanism (54), and the pressing loads can be set arbitrarily or regulated finely.</p> |
