| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a ceramics circuit board having excellent heat radiation efficiency and durability by forming a bonding member layer having heat resistance temperature of 400°C or higher, through bonding of a metal heat sink and an aluminum plate without formation of a compound layer formed of copper and aluminum at the interface between the metal heat sink and the aluminum plate, and also to provide a semiconductor module using the circuit board. <P>SOLUTION: The circuit board 1 has a metal circuit plate 3 formed in one surface of the ceramics board 2, and a metal heat sink 4 formed in the other surface. The metal circuit plate and the metallic heat sink are formed of copper or copper alloy, and an aluminum plate 20 is bonded to the metal heat sink through a silver-sintered layer 22 not including an intermetallic compound of copper and aluminum. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
