| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of liquid ejection head capable of preventing poor connection from occurring during wire bonding to a wiring pattern. SOLUTION: In the manufacturing method of liquid ejection head having a flow channel forming substrate where a pressure generating chamber in communication with a nozzle opening for jetting droplets is formed, a piezoelectric element arranged in one face side of the flow channel forming substrate, a bonded substrate bonded to the flow channel forming substrate, and a wiring pattern connected to the piezoelectric element and arranged on the surface of the opposite side of the flow channel forming substrate of the bonding substrate, the wiring pattern 200 is formed by forming a plating metal layer 204 of a predetermined pattern on the surface of the bonding substrate 30 by plating, and the surface of the plating metal layer 204 is flattened by pressing the same by a predetermined pressure by a press member 250. COPYRIGHT: (C)2008,JPO&INPIT
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