发明名称 SEMICONDUCTOR JUNCTION DEVICE HAVING REDUCED LEAKAGE CURRENT AND METHOD OF FORMING SAME
摘要 A semiconductor junction device includes a semiconductor substrate of a first conductivity type and a junction layer formed on the substrate which has a second conductivity type. A field reducing region of the first conductivity type surrounds a periphery of the junction layer and extends under a peripheral portion of the junction layer. An insulating layer is provided on the field reducing region and a metal layer overlies the junction layer and the insulating layer.
申请公布号 WO2008020982(A3) 申请公布日期 2008.08.28
申请号 WO2007US16978 申请日期 2007.07.30
申请人 VISHAY GENERAL SEMICONDUCTOR LLC;DAI, SHENG-HUEI;KING, YA-CHIN;WANG, HAI-NING;CHIANG, MING-TAI 发明人 DAI, SHENG-HUEI;KING, YA-CHIN;WANG, HAI-NING;CHIANG, MING-TAI
分类号 H01L29/47 主分类号 H01L29/47
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