| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To alleviate an operator's load in generating digital master data from design data and speed up data processing in manufacture of a semiconductor device by the image-wise exposure of a substrate. <P>SOLUTION: When data processing is speeded up with raster data and layout information on components which are constituents repeatedly described on design data for semiconductor devices, the constituents, which are repeatedly described in a hierarchy of the design data and satisfies prescribed extraction conditions, are automatically extracted, as the components, from the design data to solve the problem. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
