| 摘要 |
There is disclosed a wiring structure or the like capable of sufficiently improving a connection property between a body to be wired and a wiring pattern (layer) connected to the body to be wired. In a semiconductor-embedded substrate 1 , conductive patterns 13 are formed on opposite surfaces of a core substrate 11 , and a semiconductor device 14 is arranged in a resin layer 16 laminated on the core substrate 11 . The resin layer 16 is provided with the conductive pattern 13 and bumps 14 p of the semiconductor device 14 , and via-holes 19 a, 19 b are formed through upper portions of the resin layer. In the via-holes 19 a, 19 b, via-hole electrode portions 23 a, 23 b are connected to the conductive pattern 13 and the bumps 14 p of the semiconductor device 14 . The via-hole electrode portions 23 a, 23 b are provided so that each via-hole electrode portion has a concave portion at an upper surface thereof and so that a side wall thereof including an edge portion of the concave portion does not come in contact with an inner wall of the via-hole 19 a or 19 b.
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