| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting diode unit in which large current can be applied to an upper and lower electrode type light-emitting diode and which permits the emission of heat generated at the time of the application of large current and expansion and contraction caused by heat stress of a metal member caused by the heat, and the method of manufacturing the light-emitting diode unit. <P>SOLUTION: In a light-emitting diode unit, two metal substrates are separated via a slit to be in an insulated state. In an upper and lower electrode type light-emitting diode, a lower electrode is connected to one of the metal substrates and an upper electrode is connected by eutectic solder via the conductive connecting member to the other of the metal substrates. The rigid resin portion is composed of a thermosetting resin material formed on at least both sides of the upper and lower electrode type light emitting diode on the two metal substrates in such a manner that it crosses over the slit. A sealing material is enclosed in an inner side covered with the rigid resin portion. The upper and lower electrode type light-emitting diode is sealed with the sealing material. <P>COPYRIGHT: (C)2008,JPO&INPIT |
