发明名称 DIODE AND APPLICATIONS THEREOF
摘要 A diode with low substrate current leakage and suitable for BiCMOS process technology. A buried layer is formed on a semiconductor substrate. A connection region and well contact the buried layer. Isolation regions are adjacent to two sides of the buried layer, each deeper than the buried layer. The isolation regions and the buried layer isolate the connection zone and the well from the substrate. The first doped region in the well is a first electrode. The well and the connection region are electrically connected, acting as a second electrode.
申请公布号 US2008203424(A1) 申请公布日期 2008.08.28
申请号 US20080118364 申请日期 2008.05.09
申请人 CHEN ZI-PING;KER MING-DOU 发明人 CHEN ZI-PING;KER MING-DOU
分类号 H01L33/00;H01L23/62;H01L27/02 主分类号 H01L33/00
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